Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction

A grain-by-grain analysis of the microstructural evolution in Sn stripe under electromigration using synchrotron-based white beam x-ray microdiffraction was investigated. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation before and after electromigration. It was observed that high-resistance grains reorient with respect to the neighboring low-resistance grains. A different mechanism of grain growth under electromigration from the normal grain growth was also proposed and discussed.