John D. Cressler, James H. Comfort, et al.
IEEE Transactions on Electron Devices
A series of Si alloys and structures has been prepared by ultrahigh-vacuum chemical vapor deposition. Alloys of composition 0≤Ge/Si≤0.20 are readily deposited at T=550°C. Commensurate, defect-free strained layers are deposited up to a critical thickness, whereupon the accumulated stress in the films is accommodated by the formation of dislocation networks in the substrate wafers. A cooperative growth phenomenon is observed where the addition of 10% germane to the gaseous deposition source accelerates silane's heterogeneous reaction rate by a factor of 25. A model is proposed where Ge acts as a desorption center for mobile hydrogen adatoms on the Si[100] surface, accelerating heterogeneous silane pyrolysis by the enhanced availability of chemisorption sites.
John D. Cressler, James H. Comfort, et al.
IEEE Transactions on Electron Devices
David B. Beach, Francoise K. LeGoues, et al.
Chemistry of Materials
Maurizio Arienzo, James H. Comfort, et al.
ESSDERC 1992
Suraj J. Mathew, Guofu Niu, et al.
IEEE Electron Device Letters