Capillary bonded components for injection laser transmitter modules

Abstract

The packaging of semiconductor lasers with fibre-optic and electronic components is described, based on the use of an Si chip as a common substrate. The components are attached by flowing solder in grooves underneath the components by capillary action. The modules are small in dimension, and fabricated using automatable techniques for low cost. © 1982, The Institution of Electrical Engineers. All rights reserved.