Conference paper
GaAs Laser Source Package For Multichannel Optical Links
J.D. Crow, J.S. Harper, et al.
OFC 1977
Paper
Flip-chip bonding with solder dipping
Abstract
We report a simple technique for making flip-chip contacts. The equipment required, in addition to a small-scale photoresist clean room, is a beaker of molten solder.
Related
A. Davidson, N.F. Pedersen, et al.
Applied Physics Letters
T. Tamegai, L. Krusin-Elbaum, et al.
Physical Review B
A. Davidson, M.J. Brady, et al.
IEEE Transactions on Magnetics