Flip-chip bonding with solder dipping

M.J. Brady; A. Davidson

doi:10.1063/1.1138505

Review of Scientific Instruments

Paper

01 Jan 1985

Flip-chip bonding with solder dipping

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Abstract

We report a simple technique for making flip-chip contacts. The equipment required, in addition to a small-scale photoresist clean room, is a beaker of molten solder.

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Abstract

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Base electrodes for high dielectric constant oxide materials in silicon technology

Josephson Edge Detector, A Novel Switching Element

An automated 55 GHz cryogenic Josephson sampling oscilloscope

Phenomenological equations for the electrical conductivity of microscopically inhomogeneous materials