Flip-chip bonding with solder dipping

M.J. Brady; A. Davidson

doi:10.1063/1.1138505

Review of Scientific Instruments

Paper

01 Jan 1985

Flip-chip bonding with solder dipping

View publication

Abstract

We report a simple technique for making flip-chip contacts. The equipment required, in addition to a small-scale photoresist clean room, is a beaker of molten solder.

Paper

Summary Abstract: Laser-assisted dry process soldering

P.A. Moskowitz, A. Davidson

JVSTA

Paper

Noise temperature contours for high-sensitivity Squids

A. Davidson

Applied Physics Letters

Paper

Transient Response of Superconducting Tin Microbridges to Supercritical Current Pulses

J. Bindslev Hansen, A. Davidson, et al.

Japanese Journal of Applied Physics

Paper

Direct observation of the critical state field profile in a YBa2Cu3O7-y single crystal

T. Tamegai, L. Krusin-Elbaum, et al.

Physical Review B

View all publications

Abstract

Related

Summary Abstract: Laser-assisted dry process soldering

Noise temperature contours for high-sensitivity Squids

Transient Response of Superconducting Tin Microbridges to Supercritical Current Pulses

Direct observation of the critical state field profile in a YBa2Cu3O7-y single crystal