Jeffrey Burns

Sufi Zafar

John Rozen

Kailash Gopalakrishnan

Griselda Bonilla

Daniel Edelstein

Mike Murphy

Abu Sebastian

Markus F. Ritter

Andreas Fuhrer

Fabrizio Nichele

Donna Dillenberger

News

Research

Explainer

Redefining AI accelerators: A new chip packaging tech & a first in analog compute

IEDM 2020: Advances in memory, analog AI and interconnects point to the future of hybrid cloud and AI

IBM’s newest chip is more than meets the AI

You have Thanksgiving turkey to thank for LASIK

Vibrations could flip the switch on future superconducting devices

The IBM Research innovations powering IBM z16

NanoDx licenses IBM CMOS-compatible nanosensors for rapid COVID-19 testing tech

Hybrid Cloud

ISSCC 2022

IEDM 2021

Hardware Technology

Semiconductors

Science

AI Hardware

Healthcare

Impact Science

The world is generating reams of data each day, and the AI systems built to make sense of it all constantly need faster and more robust hardware. We’re developing new devices and architectures to support the tremendous processing power AI requires to realize its full potential.

AI has the potential to solve some of the biggest challenges facing myriad industries. At IBM Research, we’re working on semiconductor innovations for the hybrid cloud and AI — foundational hardware technology that we can use to build the next generation of chips to solve those challenges. 

Foundational Hardware Technology

We’re driving infrastructure innovations spanning physical infrastructure, operating systems, and software-defined compute, network, and storage. Our goal is to create technologies that improve performance, reliability, security, and ease of operation across hybrid and multi-cloud environments.

Hybrid Cloud Infrastructure

The hybrid cloud is creating new opportunities to transform the way scientific research is done. From access to high-performance infrastructure, to support for multi-cloud deployments and cloud-native technologies like containers and serverless computing, we're driving full-stack innovations to transform R&D.

Hybrid Cloud HPC

Semiconductors power every electronic device, from smartphones to medical equipment. With advances in research, these devices have become smaller, faster and more reliable. Together with industry partners, IBM Research is pushing the limits of chip technology for applications like cloud computing and AI.

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Operating an IBM z16 system designed and manufactured in Poughkeepsie, N.Y. 

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A new chip packaging tech & a first in analog compute

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A collection of IBM Telum 7nm processors on a silicon wafer.

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