DDR2/DDR3 interface signal integrity analysis based on IBM generic package model
- Yin Wen
- Pang Ze Gui
- et al.
- 2010
- CSTIC 2010
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Challenges and solutions of extremely thin SOI (ETSOI) for CMOS scaling to 22nm node and beyond
- Kangguo Cheng
- Ali Khakifirooz
- et al.
- 2010
- CSTIC 2010