Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
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3 results at IMAPS 2013
Heat sink induced thermo-mechanical joint strain in QFN devices
- Gerard McVicker
- Vijay Khanna
- et al.
- 2013
- IMAPS 2013
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- Y. Kawase
- M. Ikemoto
- et al.
- 2013
- IMAPS 2013