Publications

2 results at 3DIC 2014

Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack
- - Keiji Matsumoto
  - Hiroyuki Mori
  - et al.
- 2014
- 3DIC 2014
Conference paper
Characterization of particle beds in percolating thermal underfills based on centrifugation
- - Severin Zimmermann
  - Thomas Brunschwiler
  - et al.
- 2014
- 3DIC 2014
Conference paper