Publications

8 results at ECTC 2004

Injection molded solder technology for Pb-free wafer bumping
- - P. Gruber
  - D.Y. Shih
  - et al.
- 2004
- ECTC 2004
Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders
- - Yoon-Chul Sohn
  - Jin Yu
  - et al.
- 2004
- ECTC 2004
Thermal modeling of a small extreme power density macro on a high power density microprocessor chip in the presence of realistic packaging and interconnect structures
- - Kai Xiu
  - Mark Ketchen
- 2004
- ECTC 2004
Silicon optical bench for high-speed optical subassemblies
- - Christian Baks
  - Jeremy D. Schaub
  - et al.
- 2004
- ECTC 2004
Thermal impedance measurements of junction-down mounted single-side contact laser diodes
- - Guy Cohen
  - Lei Shan
  - et al.
- 2004
- ECTC 2004
Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
- - Anna W. Topol
  - Bruce K. Furman
  - et al.
- 2004
- ECTC 2004
120 Gb/s VCSEL-based parallel optical link and custom 120 Gb/s testing station
- - Daniel Kuchta
  - Young Kwark
  - et al.
- 2004
- ECTC 2004
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- - Sung K. Kang
  - Paul Lauro
  - et al.
- 2004
- ECTC 2004