Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
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Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
- T. Brunschwiler
- S. Paredes
- et al.
- 2009
- 3DIC 2009