Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections
- K. Sakuma
- N. Nagai
- et al.
- 2009
- ECTC 2009
Conference paper
Publications
10 results at ECTC 2009
Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
Conference paperHigh-bandwidth, chip-based optical interconnects on waveguide-integrated SLC for optical off-chip I/O
- Shigeru Nakagawa
- Yoichi Taira
- et al.
- 2009
- ECTC 2009
Conference paperCrack growth rate of thermally induced underfill fatigue
- Soojae Park
- Claudius Feger
- 2009
- ECTC 2009
Conference paperNovel on-chip high performance slow wave structure using discontinuous microstrip lines and multi-layer ground for compact millimeter wave applications
- Guoan Wang
- Wayne Woods
- et al.
- 2009
- ECTC 2009
Conference paperA study on crosstalk analysis in aggregative transmission lines with turning vias
- Tapobrata Bandyopadhyay
- Lei Shan
- et al.
- 2009
- ECTC 2009
Conference paperThe over-bump applied resin wafer-level underfill process: Process, material and reliability
- Claudius Feger
- Nancy LaBianca
- et al.
- 2009
- ECTC 2009
Conference paperThe effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Conference paperDelamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
Conference paperUltrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2009
- ECTC 2009
Conference paper