On the path to AI hardware via chiplet integration enabled by high density organic substrates
- Griselda Bonilla
- Brian Quinlan
- et al.
- 2023
- ECTC 2023
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Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading
- Assane Dione
- Jean-Francois Morissette
- et al.
- 2023
- ECTC 2023
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Fashion Faux Pas: Implicit Stylistic Fingerprints for Bypassing Browsers' Anti-Fingerprinting Defenses
- Xu Lin
- Frederico Araujo
- et al.
- 2023
- S&P 2023
Rethinking Searchable Symmetric Encryption
- Zichen Gui
- Kenneth G. Paterson
- et al.
- 2023
- S&P 2023
Federated Learning with Flexible Control
- Shiqiang Wang
- Jake Perazzone
- et al.
- 2023
- INFOCOM 2023
Decomposing a Recurrent Neural Network into Modules for Enabling Reusability and Replacement
- Sayem Mohammad Imtiaz
- Fraol Batole
- et al.
- 2023
- ICSE 2023
Adhere: Automated Detection and Repair of Intrusive Ads
- Yutian Yan
- Yunhui Zheng
- et al.
- 2023
- ICSE 2023