Publications

Open3DIS Open-Vocabulary 3D Instance Segmentation with 2D Mask Guidance
- - Phuc Nguyen
  - Tuan Duc Ngo
  - et al.
- 2024
- CVPR 2024
Conference paper
What When and Where? Self-Supervised Spatio Temporal Grounding in Untrimmed Multi-Action Videos from Narrated Instructions
- - Brian Chen
  - Nina Shvetsova
  - et al.
- 2024
- CVPR 2024
Conference paper
Resource- Efficient Transformer Pruning for Finetuning of Large Models
- - Fatih Ilhan
  - Gong Su
  - et al.
- 2024
- CVPR 2024
Conference paper
A 400-ns-Settling Time Hybrid Dynamic Voltage Frequency Scaling Architecture and Its Application in a 22-Core Network-on-Chip SoC in 12-nm FinFET Technology
- - Erik Loscalzo
  - Martin Cochet
  - et al.
- 2024
- VLSI Technology and Circuits 2024
Conference paper
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- - Divya Taneja
  - Jonathan Grenier
  - et al.
- 2024
- ECTC 2024
Conference paper
Laser Attach Process Development and material selection
- - Alexander Janta-Polczynski
  - Elaine Cyr
  - et al.
- 2024
- ECTC 2024
Conference paper
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- - Sari Zerey
  - Junghyun Cho
  - et al.
- 2024
- ECTC 2024
Conference paper
Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- - Frank Libsch
  - Steve Bedell
  - et al.
- 2024
- ECTC 2024
Conference paper
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- - Minhua Lu
  - Evan Colgan
- 2024
- ECTC 2024
Conference paper
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2024
- ECTC 2024
Conference paper