1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
Publications
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Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading
- Assane Dione
- Jean-Francois Morissette
- et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Rethinking Searchable Symmetric Encryption
- Zichen Gui
- Kenneth G. Paterson
- et al.
- 2023
- S&P 2023
Fashion Faux Pas: Implicit Stylistic Fingerprints for Bypassing Browsers' Anti-Fingerprinting Defenses
- Xu Lin
- Frederico Araujo
- et al.
- 2023
- S&P 2023
Federated Learning with Flexible Control
- Shiqiang Wang
- Jake Perazzone
- et al.
- 2023
- INFOCOM 2023
Decomposing a Recurrent Neural Network into Modules for Enabling Reusability and Replacement
- Sayem Mohammad Imtiaz
- Fraol Batole
- et al.
- 2023
- ICSE 2023
Adhere: Automated Detection and Repair of Intrusive Ads
- Yutian Yan
- Yunhui Zheng
- et al.
- 2023
- ICSE 2023
Automated Metamorphic Testing using Transitive Relations for Specializing Stance Detection Models
- Alisa Arno
- Futoshi Iwama
- et al.
- 2023
- ICSE 2023
Silicon photonic co-packaging: Adhesive dispense challenge and control
- Paul Gond-Charton
- Sebastien Gouin
- et al.
- 2023
- ECTC 2023