MXFaaS: Resource Sharing in Serverless Environments for Parallelism and Efficiency
- Jovan Stojkovic
- Hubertus Franke
- et al.
- 2023
- ISCA 2023
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A Switched-Capacitor Integer Compute Unit with Decoupled Storage and Arithmetic for Cloud AI Inference in 5nm CMOS
- Ankur Agrawal
- Monodeep Kar
- et al.
- 2023
- VLSI Technology 2023
Contact Cavity Shaping and Selective SiGe:B Low-Temperature Epitaxy Process Solution for sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs
- N. Breil
- B.-C. Lee
- et al.
- 2023
- VLSI Technology 2023
A 1.9GHz 0.57V Vmin 576Kb embedded product-ready L2 cache in 5nm FinFET technology
- N. Jungmann
- Rajiv V. Joshi
- et al.
- 2023
- VLSI Technology 2023
Quantum Dots Array on Ultra-Thin SOI Nanowires with Ferromagnetic Cobalt Barrier Gates for Enhanced Spin Qubit Control
- Fabio Bersano
- Michele Aldeghi
- et al.
- 2023
- VLSI Technology 2023
Proactive Power Regulation with Real-time Prediction and Fast Response Guardband for Fine-grained Dynamic Voltage Droop Mitigation on Digital SoCs
- Xi Chen
- Jiaxiang Feng
- et al.
- 2023
- VLSI Technology 2023
High Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- Hidetoshi Numata
- Toshiyuki Yamane
- et al.
- 2023
- ECTC 2023
Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- Hafiz Wakas Ali
- David Danovitch
- et al.
- 2023
- ECTC 2023
HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results
- Frank R. Libsch
- Hiroyuki Mori
- 2023
- ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023