Publications

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- - Jae-Woong Nah
  - Michael A. Gaynes
  - et al.
- 2011
- ECTC 2011
Solder/adhesive bonding using simple planarization technique for 3D integration
- - Masatsugu Nimura
  - Jun Mizuno
  - et al.
- 2011
- ECTC 2011
Deploying CogTool: Integrating quantitative usability assessment into real-world software development
- - Rachel Bellamy
  - Bonnie John
  - et al.
- 2011
- ICSE 2011
Using MATCON to generate CASE tools that guide deployment of pre-packaged applications
- - Elad Fein
  - Natalia Razinkov
  - et al.
- 2011
- ICSE 2011
Angelic debugging
- - Satish Chandra
  - Emina Torlak
  - et al.
- 2011
- ICSE 2011
Workshop on Cooperative and Human Aspects of Software Engineering (CHASE 2011)
- - Marcelo Cataldo
  - Cleidson De Souza
  - et al.
- 2011
- ICSE 2011
Refactoring Java programs for flexible locking
- - Max Schäfer
  - Manu Sridharan
  - et al.
- 2011
- ICSE 2011
Second international workshop on Product Line Approaches in Software Engineering (PLEASE 2011)
- - Julia Rubin
  - Goetz Botterweck
  - et al.
- 2011
- ICSE 2011
Sketching tools for ideation (NIER track)
- - Rachel Bellamy
  - Michael Desmond
  - et al.
- 2011
- ICSE 2011
Workshop on flexible modeling tools (FlexiTools 2011)
- - Harold Ossher
  - André Van Der Hoek
  - et al.
- 2011
- ICSE 2011