Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Publications
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Terabit/sec 48-channel fiber-coupled optical module based on holey CMOS transceiver IC
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2012
- ECTC 2012
SmartScale: Automatic application scaling in enterprise clouds
- Sourav Dutta
- Sankalp Gera
- et al.
- 2012
- CLOUD 2012
Remediating overload in over-subscribed computing environments
- Long Wang
- Rafah A. Hosn
- et al.
- 2012
- CLOUD 2012
Facilitating business-oriented cloud transformation decision with cloud transformation advisor
- Fan Jing Meng
- Jian Wang
- et al.
- 2012
- CLOUD 2012