Publications

2.5D and 3D technology challenges and test vehicle demonstrations
- - John Knickerbocker
  - Paul Andry
  - et al.
- 2012
- ECTC 2012
Efficient parametric modeling and analysis for backplane channel characterization
- - Xiaoxiong Gu
  - Ki Jin Han
  - et al.
- 2012
- ECTC 2012
The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- - Gregory Parks
  - Babak Arfaei
  - et al.
- 2012
- ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- - Jae-Woong Nah
  - Michael Gaynes
  - et al.
- 2012
- ECTC 2012
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- - Minhua Lu
  - Steven L. Wright
  - et al.
- 2012
- ECTC 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- - Zheng Xu
  - Xiaoxiong Gu
  - et al.
- 2012
- ECTC 2012
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- - Steven L. Wright
  - Cornelia Tsang
  - et al.
- 2012
- ECTC 2012
Data centers in the cloud: A large scale performance study
- - Robert Birke
  - Lydia Y. Chen
  - et al.
- 2012
- CLOUD 2012
Remediating overload in over-subscribed computing environments
- - Long Wang
  - Rafah A. Hosn
  - et al.
- 2012
- CLOUD 2012
Reliable state monitoring in cloud datacenters
- - Shicong Meng
  - Arun K. Iyengar
  - et al.
- 2012
- CLOUD 2012