Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Publications
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
Terabit/sec 48-channel fiber-coupled optical module based on holey CMOS transceiver IC
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2012
- ECTC 2012
Minimizing latency in serving requests through differential template caching in a cloud
- Deepak Jeswani
- Manish Gupta
- et al.
- 2012
- CLOUD 2012
Biting off Safely More than You Can Chew: Predictive analytics for resource over-commit in IaaS cloud
- Rahul Ghosh
- Vijay K. Naik
- 2012
- CLOUD 2012
VM placement strategies for cloud scenarios
- Nicolò Maria Calcavecchia
- Ofer Biran
- et al.
- 2012
- CLOUD 2012