Efficient parametric modeling and analysis for backplane channel characterization
- Xiaoxiong Gu
- Ki Jin Han
- et al.
- 2012
- ECTC 2012
Publications
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- Gregory Parks
- Babak Arfaei
- et al.
- 2012
- ECTC 2012
Opportunistic service provisioning in the cloud
- Mathias Björkqvist
- Lydia Y. Chen
- et al.
- 2012
- CLOUD 2012
Semantically-rich composition of virtual images
- Fábio Oliveira
- Tamar Eilam
- et al.
- 2012
- CLOUD 2012
Biting off Safely More than You Can Chew: Predictive analytics for resource over-commit in IaaS cloud
- Rahul Ghosh
- Vijay K. Naik
- 2012
- CLOUD 2012