Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
Publications
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- ECTC 2012
Efficient parametric modeling and analysis for backplane channel characterization
- Xiaoxiong Gu
- Ki Jin Han
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Optimal bids for spot VMs in a cloud for deadline constrained jobs
- Murtaza Zafer
- Yang Song
- et al.
- 2012
- CLOUD 2012
Remediating overload in over-subscribed computing environments
- Long Wang
- Rafah A. Hosn
- et al.
- 2012
- CLOUD 2012
SmartScale: Automatic application scaling in enterprise clouds
- Sourav Dutta
- Sankalp Gera
- et al.
- 2012
- CLOUD 2012
Semantically-rich composition of virtual images
- Fábio Oliveira
- Tamar Eilam
- et al.
- 2012
- CLOUD 2012
VM placement strategies for cloud scenarios
- Nicolò Maria Calcavecchia
- Ofer Biran
- et al.
- 2012
- CLOUD 2012
Biting off Safely More than You Can Chew: Predictive analytics for resource over-commit in IaaS cloud
- Rahul Ghosh
- Vijay K. Naik
- 2012
- CLOUD 2012