Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe ICFuad E. DoanyDaniel M. Kuchtaet al.2014ECTC 2014
Factors in the selection of temporary wafer handlers for 3D/2.5D integrationBing DangBucknell Webbet al.2014ECTC 2014
Development of electroless nickel-iron plating process for microelectronic applicationsYu LuoSung K. Kanget al.2014ECTC 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substratesBing DangJoana Mariaet al.2014ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chipsTymon BarwiczYoichi Tairaet al.2014ECTC 2014
Bonding technologies for chip level and wafer level 3D integrationKatsuyuki SakumaSpyridon Skordaset al.2014ECTC 2014