Publications

Bonding technologies for chip level and wafer level 3D integration
- - Katsuyuki Sakuma
  - Spyridon Skordas
  - et al.
- 2014
- ECTC 2014
Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- - Fuad E. Doany
  - Daniel M. Kuchta
  - et al.
- 2014
- ECTC 2014
Preparing 25Gbps electrical I/O for exascale computing systems
- - Lei Shan
  - Young Kwark
  - et al.
- 2014
- ECTC 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- - Bing Dang
  - Joana Maria
  - et al.
- 2014
- ECTC 2014
Development of electroless nickel-iron plating process for microelectronic applications
- - Yu Luo
  - Sung K. Kang
  - et al.
- 2014
- ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- - Tymon Barwicz
  - Yoichi Taira
  - et al.
- 2014
- ECTC 2014
Wafer-level non conductive films for exascale servers
- - Akihiro Horibe
  - Sayuri Kohara
  - et al.
- 2014
- ECTC 2014
Time, temperature, and mechanical fatigue dependence on underfill adhesion
- - Joseph Cremaldi
  - Michael Gaynes
  - et al.
- 2014
- ECTC 2014
Nanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
- - Yoichi Taira
  - Ryuma Mizusawa
  - et al.
- 2014
- ECTC 2014
Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- - Huanyu He
  - Xiaoxiong Gu
  - et al.
- 2014
- ECTC 2014