Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2014
- ECTC 2014
Publications
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Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Wafer-level non conductive films for exascale servers
- Akihiro Horibe
- Sayuri Kohara
- et al.
- 2014
- ECTC 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- Bing Dang
- Bucknell Webb
- et al.
- 2014
- ECTC 2014
Advanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014
Development of electroless nickel-iron plating process for microelectronic applications
- Yu Luo
- Sung K. Kang
- et al.
- 2014
- ECTC 2014
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Controlling the Sn grain morphology of SnAg C4 solder bumps
- Gregory Parks
- Minhua Lu
- et al.
- 2014
- ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2014
- ECTC 2014