Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- - Jae Woong Nah
  - Jeffrey Gelorme
  - et al.
- 2014
- ECTC 2014
Wafer-level non conductive films for exascale servers
- - Akihiro Horibe
  - Sayuri Kohara
  - et al.
- 2014
- ECTC 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- - Bing Dang
  - Joana Maria
  - et al.
- 2014
- ECTC 2014
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- - Bing Dang
  - Bucknell Webb
  - et al.
- 2014
- ECTC 2014
Advanced wafer bonding and laser debonding
- - Paul Andry
  - Russell A. Budd
  - et al.
- 2014
- ECTC 2014
Development of electroless nickel-iron plating process for microelectronic applications
- - Yu Luo
  - Sung K. Kang
  - et al.
- 2014
- ECTC 2014
Bonding technologies for chip level and wafer level 3D integration
- - Katsuyuki Sakuma
  - Spyridon Skordas
  - et al.
- 2014
- ECTC 2014
Controlling the Sn grain morphology of SnAg C4 solder bumps
- - Gregory Parks
  - Minhua Lu
  - et al.
- 2014
- ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- - Tymon Barwicz
  - Yoichi Taira
  - et al.
- 2014
- ECTC 2014
Transferrable fine pitch probe technology
- - Y. Liu
  - S.L. Wright
  - et al.
- 2014
- ECTC 2014