Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

Adaptable privacy-preserving data curation for business process analysis services
- - Michiharu Kudo
  - Kumiko Maeda
  - et al.
- 2016
- SCC 2016
ReAct: A system for recommending actions for rapid resolution of IT service incidents
- - V. Aggarwal
  - Shivali Agarwal
  - et al.
- 2016
- SCC 2016
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- - Bing Dang
  - Evan Colgan
  - et al.
- 2016
- ECTC 2016
Solder Injected through Via for Multi Stacked Wafers
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2016
- ECTC 2016
A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain
- - Fuad Doany
  - Russell A. Budd
  - et al.
- 2016
- ECTC 2016
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
- - Yves Martin
  - Jae Woong Nah
  - et al.
- 2016
- ECTC 2016
Scalable Optical Coupling between Silicon Photonics Waveguides and Polymer Waveguides
- - A. La Porta
  - Roger Dangel
  - et al.
- 2016
- ECTC 2016
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- - Katsuyuki Sakuma
  - Bucknell Webb
  - et al.
- 2016
- ECTC 2016
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- - Jonas Zürcher
  - Luca Del Carro
  - et al.
- 2016
- ECTC 2016
3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS
- - J. Safran
  - Giri N. K. Rangan
  - et al.
- 2016
- ECTC 2016