Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders
- Sun-Kyoung Seo
- Moon Gi Cho
- et al.
- 2011
- ECTC 2011
Publications
11 results for Moon Gi Cho
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2011
- Journal of Materials Research
Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2010
- JOM
The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2008
- ECTC 2008
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Undercooling and microhardness of Pb-free solders on various under bump metallurgies
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2008
- Journal of Materials Research
Critical factors affecting the undercooling of Pb-free, flip-chip solder bumps and in-situ observation of solidification process
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2007
- ECTC 2007
Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2007
- Journal of Electronic Materials