3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
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Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Kamal Sikka
- Ravi Bonam
- et al.
- 2021
- ECTC 2021