Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part B
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2016
- ITherm 2016
Publications
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152 results for Thomas Brunschwiler
Re-building the Underfill: Performance of percolating fillers at package scale
- Uwe Zschenderlein
- Mario Baum
- et al.
- 2016
- EuroSimE 2016
Stress investigations in 3D-integrated silicon microstructures
- M. Stiebing
- Emanuel Lörtscher
- et al.
- 2016
- EuroSimE 2016
Master curve synthesis by effective viscoelastic plastic material modeling
- Florian Schindler-Saefkow
- Remi Pantou
- et al.
- 2016
- EuroSimE 2016
Quantifying the thermal conductivity enhancement of percolating thermal underfills
- Brian R. Burg
- Jonas Zürcher
- et al.
- 2015
- EMPC 2015
Modeling and multi-objective optimization of 2.5D inductor-based Fully Integrated Voltage Regulators for microprocessor applications
- Pedro André Martins Bezerra
- Florian Krismer
- et al.
- 2015
- COBEP/SPEC 2015
Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- Jonas Zürcher
- Xi Chen
- et al.
- 2015
- NANO 2015
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2015
- InterPACK 2015
LID-integral cold plate topology integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2015
- InterPACK 2015