Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
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154 results for Thomas Brunschwiler
Scalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Exploration of inductor-based hybrid integrated voltage regulator architectures
- Arvind Sridhar
- Thomas Brunschwiler
- et al.
- 2016
- ESTC 2016
Intra-stack sealing of tier interconnects using the interconnect alloy
- Jessica Kleff
- Gerd Schlottig
- et al.
- 2016
- ESTC 2016
Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
- Thomas Brunschwiler
- Raúl Mroßko
- et al.
- 2016
- ESTC 2016
Control and Implementation Aspects of a Multiphase Inductor-Based FIVR in 14 nm Bulk CMOS for Microprocessor Applications
- Riduan K. Aljameh
- Pedro A. M. Bezerra
- et al.
- 2016
- PwSoC 2016
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part A
- Arvind Sridhar
- Ozgur Ozsun
- et al.
- 2016
- ITherm 2016
Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part B
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2016
- ITherm 2016
Re-building the Underfill: Performance of percolating fillers at package scale
- Uwe Zschenderlein
- Mario Baum
- et al.
- 2016
- EuroSimE 2016