The thermal and electrical transport capabilities of materials in electronic packaging are key to supporting high-performance microelectronic systems. In composite and hybrid materials, both of these transport capabilities are limited by contact resistances. We propose a directed nanoparticle assembly method to reduce contact resistances by transforming point contacts between micrometer-sized objects into quasi-areal contacts. The nanoparticle assembly is directed by the formation of liquid bridges in contact points during the evaporation of a colloidal suspension. In this work, we experimentally study the evaporation of colloidal suspensions in confined porous media to yield uniform nanoparticle assembly, as required for electronic packaging. The evaporation pattern of liquids in confined pillar arrays is either branched or straight, depending on the surface tension of the liquid and on the pore size defined by the pillar size and spacing. Stable evaporation fronts result in uniform nanoparticle deposition above a bond number threshold of 10- 3. However, at reduced evaporation dynamics, liquid pinning results from colloidal particle accumulations at the liquid–vapor interface, ultimately leading to undesired colloidal bridging between pillars.