A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
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D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Role of Interfacial Microstructure on Electromigration Behavior of The Hybrid Bonding in 3D Integration
- Sari Zerey
- Roy Yu
- et al.
- 2024
- MRS Spring Meeting 2024