High Volume Manufacturing Innovations for Metal-Oxide Resist Patterning
- Nicholas Latham
- Jennifer Church
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Publications
25 results for Jennifer Church
Predicting and Measuring Scummed Contact Holes
- Elisa Novelli
- Chris A. Mack
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- Luciana Meli
- Indira Seshadri
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Wet clean oxidation for optimal line width and LER
- Steven McDermott
- Keith Donegan
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
A novel single damascene process for via metal corrosion-free interconnects in advanced nodes
- Koichi Motoyama
- Dominik Metzler
- et al.
- 2024
- IITC 2024
EUV patterned gate variation reduction in next generation transistor architectures
- Gopal Kenath
- Martin Burkhardt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Scaling opportunities for Gate-All-Around: A patterning perspective
- I. Seshadri
- E. Miller
- et al.
- 2023
- IEDM 2023
Scaling opportunities for Gate-All-Around and beyond: A patterning perspective
- Indira Seshadri
- Eric Miller
- et al.
- 2023
- IEDM 2023
Throughput vs. Yield: reviewing the metrology needs for stochastics-aware process window analysis (SA-PWA)
- Jennifer Church
- Luciana Meli
- 2022
- SPIE Advanced Lithography 2022