Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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9 results for Xiaomin Duan

A through-silicon-via to active device noise coupling study for CMOS SOI technology
- - Xiaomin Duan
  - Xiaoxiong Gu
  - et al.
- 2011
- ECTC 2011
Signal and power integrity (SPI) co-analysis for high-speed communication channels
- - Renato Rimolo-Donadio
  - Xiaomin Duan
  - et al.
- 2013
- DesignCon 2013
Framework for co-simulation of signal and power integrity in server systems
- - Thomas-Michael Winkel
  - Hubert Harrer
  - et al.
- 2012
- EPEPS 2012
Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts
- - Xiaoxiong Gu
  - Joel Silberman
  - et al.
- 2012
- EPEPS 2012
Impact of multiple scattering on passivity of equivalent-circuit via models
- - Xiaomin Duan
  - Renato Rimolo-Donadio
  - et al.
- 2011
- EDAPS 2011
Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
- - Torsten Reuschel
  - Jan B. Preibisch
  - et al.
- 2017
- IEEE Transactions on CPMT
Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
- - Xiaoxiong Gu
  - Joel A. Silberman
  - et al.
- 2013
- IEEE Transactions on CPMT
Complete modeling of large via constellations in multilayer printed circuit boards
- - Sebastian Müller
  - Fabian Happ
  - et al.
- 2013
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- - Sebastian Müller
  - Xiaomin Duan
  - et al.
- 2012
- IEEE Trans Electromagn Compat