A through-silicon-via to active device noise coupling study for CMOS SOI technology
- Xiaomin Duan
- Xiaoxiong Gu
- et al.
- 2011
- ECTC 2011
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9 results for Xiaomin Duan
Signal and power integrity (SPI) co-analysis for high-speed communication channels
- Renato Rimolo-Donadio
- Xiaomin Duan
- et al.
- 2013
- DesignCon 2013
Framework for co-simulation of signal and power integrity in server systems
- Thomas-Michael Winkel
- Hubert Harrer
- et al.
- 2012
- EPEPS 2012
Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts
- Xiaoxiong Gu
- Joel Silberman
- et al.
- 2012
- EPEPS 2012
Impact of multiple scattering on passivity of equivalent-circuit via models
- Xiaomin Duan
- Renato Rimolo-Donadio
- et al.
- 2011
- EDAPS 2011
Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
- Torsten Reuschel
- Jan B. Preibisch
- et al.
- 2017
- IEEE Transactions on CPMT
Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
- Xiaoxiong Gu
- Joel A. Silberman
- et al.
- 2013
- IEEE Transactions on CPMT
Complete modeling of large via constellations in multilayer printed circuit boards
- Sebastian Müller
- Fabian Happ
- et al.
- 2013
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat