Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
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3 results for Joshua Rubin
BEOL compatible high-capacitance MIMCAP structure using a novel high k material
- P. Jamison
- John Massey
- et al.
- 2020
- IMCS 2020
Essential edge protection techniques for successful multi-wafer stacking
- Joshua Rubin
- Kevin Winstel
- et al.
- 2015
- S3S 2015