Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Featured collections

Popular topics

Year

7 results for Eiji Nakamura

Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- - Toyohiro Aoki
  - Eiji Nakamura
  - et al.
- 2020
- ECTC 2020
Study of design optimization method for ultra-low power micro gas sensor
- - Eiji Nakamura
  - Keiji Matsumoto
  - et al.
- 2019
- ECTC 2019
Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- - Toyohiro Aoki
  - Takashi Hisada
  - et al.
- 2016
- ECTC 2016
A portable potentiometric electronic tongue leveraging smartphone and cloud platforms
- - Patrick W. Ruch
  - Rui Hu
  - et al.
- 2019
- ISOEN 2019
Flip chip joining with low temperature solders and thermal gradient bonding
- - Toyohiro Aoki
  - Eiji Nakamura
  - et al.
- 2017
- ICEP 2017
Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- - Toyohiro Aoki
  - Takashi Hisada
  - et al.
- 2016
- ICEP 2016
Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- - Jun Mukawa
  - Seiichirou Takahashi
  - et al.
- 2016
- J. Photopolym. Sci. Tech.