Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
- Risa Miyazawa
- Eiji Nakamura
- et al.
- 2021
- Advancing Microelectronics
Paper
Publications
9 results for Eiji Nakamura
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- Eiji Nakamura
- Toyohiro Aoki
- et al.
- 2021
- Advancing Microelectronics
PaperPlating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2020
- ECTC 2020
Conference paperStudy of design optimization method for ultra-low power micro gas sensor
- Eiji Nakamura
- Keiji Matsumoto
- et al.
- 2019
- ECTC 2019
Conference paperA portable potentiometric electronic tongue leveraging smartphone and cloud platforms
- Patrick W. Ruch
- Rui Hu
- et al.
- 2019
- ISOEN 2019
Conference paperFlip chip joining with low temperature solders and thermal gradient bonding
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2017
- ICEP 2017
Conference paperNovel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ECTC 2016
Conference paperEffects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ICEP 2016
Conference paperDevelopment of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- Jun Mukawa
- Seiichirou Takahashi
- et al.
- 2016
- J. Photopolym. Sci. Tech.
Paper