About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
International Cryogenic Materials Conference 1983
Conference paper
AGING RESPONSE AND CRYOGENIC MECHANICAL PROPERTIES OF AN In-Sn EUTECTIC SOLDER ALLOY FOR JOSEPHSON PACKAGING.
Abstract
Josephson computing technology entails the use of superconducting Josephson junction devices which combine high speeds and low power dissipation compared to conventional semiconductor devices. A low melting point (390K) In (52 weight %) Sn (48 weight %) eutectic alloy which is superconducting at 4. 2K is used as an interconnection solder in Josephson packaging to enable chip and package part replacements to be done at reasonably low temperatures.