AGING RESPONSE AND CRYOGENIC MECHANICAL PROPERTIES OF AN In-Sn EUTECTIC SOLDER ALLOY FOR JOSEPHSON PACKAGING.

Abstract

Josephson computing technology entails the use of superconducting Josephson junction devices which combine high speeds and low power dissipation compared to conventional semiconductor devices. A low melting point (390K) In (52 weight %) Sn (48 weight %) eutectic alloy which is superconducting at 4. 2K is used as an interconnection solder in Josephson packaging to enable chip and package part replacements to be done at reasonably low temperatures.