Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

Takashi Hisada, Sayuri Kohara, et al.

ICEP 2022

Conference paper

IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping

Toyohiro Aoki, Kazushige Toriyama, et al.

IMAPS 2014

Conference paper

Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Keiji Matsumoto, Takahito Watanabe, et al.

ECTC 2022

Conference paper

Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Eiji Nakamura, et al.

ECTC 2020

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