Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process

Chinami Marushima, Toyohiro Aoki, et al.

ICEP 2021

Conference paper

Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Takashi Hisada, et al.

ECTC 2016

Conference paper

IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping

Toyohiro Aoki, Kazushige Toriyama, et al.

IMAPS 2014

Paper

Energy-efficient 1060-nm optical link operating up to 28 Gb/s

Jean Benoit Héroux, Tomofumi Kise, et al.

Journal of Lightwave Technology

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