Conference paperThermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu PillarTakashi Hisada, Sayuri Kohara, et al.ICEP 2022
Conference paperCharacterization of micro bump formed by Injection Molded Solder (IMS) technologyToyohiro Aoki, Kazushige Toriyama, et al.ICEP 2014
Conference paperPlating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip JoiningToyohiro Aoki, Eiji Nakamura, et al.ECTC 2020
Conference paperNovel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip JoiningToyohiro Aoki, Takashi Hisada, et al.ECTC 2016
