Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping

Toyohiro Aoki, Kazushige Toriyama, et al.

IMAPS 2014

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

Conference paper

IMC bonding for 3D interconnection

Katsuyuki Sakuma, Kuniaki Sueoka, et al.

ECTC 2010

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Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

Takashi Hisada, Sayuri Kohara, et al.

ICEP 2022

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