Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Characterization of micro bump formed by Injection Molded Solder (IMS) technology

Toyohiro Aoki, Kazushige Toriyama, et al.

ICEP 2014

Conference paper

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima, Toyohiro Aoki, et al.

ECTC 2022

Conference paper

Advanced interconnect technologies in the era of cognitive computing

Yasumitsu Orii, Akihiro Horibe, et al.

Pan Pacific 2016

Conference paper

Implementation challenges for scalable neuromorphic computing

Shintaro Yamamichi, Akihiro Horibe, et al.

VLSI Circuits 2017

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