Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Takashi Hisada, et al.

ECTC 2016

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

Sayuri Kohara, Toyohiro Aoki, et al.

ITherm 2022

Conference paper

Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Keiji Matsumoto, Takahito Watanabe, et al.

ECTC 2022

Conference paper

Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Eiji Nakamura, et al.

ECTC 2020

View all publications