Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology

Toyohiro Aoki, Takashi Hisada, et al.

ICEP 2016

Paper

Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability

Risa Miyazawa, Eiji Nakamura, et al.

Advancing Microelectronics

Paper

Full intermetallic joints for chip stacking by using thermal gradient bonding

T.L. Yang, Toyohiro Aoki, et al.

Acta Materialia

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

Sayuri Kohara, Toyohiro Aoki, et al.

ITherm 2022

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