Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Eiji Nakamura, et al.

ECTC 2020

Conference paper

Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology

Toyohiro Aoki, Takashi Hisada, et al.

ICEP 2016

Conference paper

Low power CMOS-driven 1060 nm multimode optical link

Jean Benoit Héroux, Tomofumi Kise, et al.

OFC 2014

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

Sayuri Kohara, Toyohiro Aoki, et al.

ITherm 2022

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