Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Eiji Nakamura, et al.

ECTC 2020

Conference paper

Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Takashi Hisada, et al.

ECTC 2016

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

Conference paper

Effect of Interfacial Wetting on First Level Interconnect Joint Formation For Low Temperature Solders-iNEMI Project

Shripad Gokhale, Edvin Cetegen, et al.

ICEP-IAAC 2025

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