Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Paper

Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability

Risa Miyazawa, Eiji Nakamura, et al.

Advancing Microelectronics

Conference paper

Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology

Toyohiro Aoki, Katsuhiro Yoshida, et al.

ICEP 2021

Conference paper

Flip chip joining with low temperature solders and thermal gradient bonding

Toyohiro Aoki, Eiji Nakamura, et al.

ICEP 2017

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

View all publications