Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Flip Chip Joining with Injection Molded Solder Technology

Takashi Hisada, Toyohiro Aoki

EDTM 2023

Conference paper

Solder Injected through Via for Multi Stacked Wafers

Akihiro Horibe, Kuniaki Sueoka, et al.

ECTC 2016

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

Conference paper

Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process

Chinami Marushima, Toyohiro Aoki, et al.

ICEP 2021

View all publications