Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

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ICEP 2022

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Effect of Interfacial Wetting on First Level Interconnect Joint Formation For Low Temperature Solders-iNEMI Project

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ICEP-IAAC 2025

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Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology

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ICEP 2016

Conference paper

Implementation challenges for scalable neuromorphic computing

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VLSI Technology 2017

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