Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Paper

Full intermetallic joints for chip stacking by using thermal gradient bonding

T.L. Yang, Toyohiro Aoki, et al.

Acta Materialia

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

Sayuri Kohara, Toyohiro Aoki, et al.

ITherm 2022

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

Paper

Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability

Jun Mukawa, Seiichirou Takahashi, et al.

J. Photopolym. Sci. Tech.

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