Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

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Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

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Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

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