Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

Takashi Hisada, Sayuri Kohara, et al.

ICEP 2022

Conference paper

Through silicon via process for effective multi-wafer integration

Akihiro Horibe, Kuniaki Sueoka, et al.

ECTC 2015

Paper

Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability

Risa Miyazawa, Eiji Nakamura, et al.

Advancing Microelectronics

Conference paper

Flip Chip Joining with Injection Molded Solder Technology

Takashi Hisada, Toyohiro Aoki

EDTM 2023

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