Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Scaling challenges of semiconductor packaging in the era of big data

Yasumitsu Orii, Akihiro Horibe, et al.

IMAPS 2013

Conference paper

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima, Toyohiro Aoki, et al.

ECTC 2022

Conference paper

IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping

Toyohiro Aoki, Kazushige Toriyama, et al.

IMAPS 2014

Conference paper

Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process

Chinami Marushima, Toyohiro Aoki, et al.

ICEP 2021

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