Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Solder Injected through Via for Multi Stacked Wafers

Akihiro Horibe, Kuniaki Sueoka, et al.

ECTC 2016

Conference paper

Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Takashi Hisada, et al.

ECTC 2016

Paper

Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability

Risa Miyazawa, Eiji Nakamura, et al.

Advancing Microelectronics

Conference paper

Characterization of micro bump formed by Injection Molded Solder (IMS) technology

Toyohiro Aoki, Kazushige Toriyama, et al.

ICEP 2014

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