Conference paperDimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge PackageChinami Marushima, Toyohiro Aoki, et al.ECTC 2022
PaperSimulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capabilityRisa Miyazawa, Eiji Nakamura, et al.Advancing Microelectronics
PaperEnergy-efficient 1060-nm optical link operating up to 28 Gb/sJean Benoit Héroux, Tomofumi Kise, et al.Journal of Lightwave Technology
Conference paperThrough silicon via process for effective multi-wafer integrationAkihiro Horibe, Kuniaki Sueoka, et al.ECTC 2015
