Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Paper

Development and commercialization of solder bump fabrication technology with molten solder injection method

Toyohiro Aoki, Kazushige Toriyama, et al.

J. Jpn. Inst. Electron. Packag.

Conference paper

Flip Chip Joining with Injection Molded Solder Technology

Takashi Hisada, Toyohiro Aoki

EDTM 2023

Conference paper

Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Keiji Matsumoto, Takahito Watanabe, et al.

ECTC 2022

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

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