Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Paper

Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability

Risa Miyazawa, Eiji Nakamura, et al.

Advancing Microelectronics

Conference paper

Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

Toyohiro Aoki, Katsuyuki Sakuma, et al.

ECTC 2023

Conference paper

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima, Toyohiro Aoki, et al.

ECTC 2022

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

Sayuri Kohara, Toyohiro Aoki, et al.

ITherm 2022

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