Conference paperPlating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip JoiningToyohiro Aoki, Eiji Nakamura, et al.ECTC 2020
Conference paperEffects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technologyToyohiro Aoki, Takashi Hisada, et al.ICEP 2016
Conference paperLow power CMOS-driven 1060 nm multimode optical linkJean Benoit Héroux, Tomofumi Kise, et al.OFC 2014
Conference paperAnalysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element methodSayuri Kohara, Toyohiro Aoki, et al.ITherm 2022