Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Paper

Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability

Jun Mukawa, Seiichirou Takahashi, et al.

J. Photopolym. Sci. Tech.

Conference paper

Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki, Takashi Hisada, et al.

ECTC 2016

Conference paper

Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration

Kuniaki Sueoka, Akihiro Horibe, et al.

3DIC 2015

Conference paper

Implementation challenges for scalable neuromorphic computing

Shintaro Yamamichi, Akihiro Horibe, et al.

VLSI Technology 2017

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