Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology

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ICEP 2021

Paper

Full intermetallic joints for chip stacking by using thermal gradient bonding

T.L. Yang, Toyohiro Aoki, et al.

Acta Materialia

Conference paper

Flip chip joining with low temperature solders and thermal gradient bonding

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ICEP 2017

Conference paper

Implementation challenges for scalable neuromorphic computing

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VLSI Technology 2017

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