Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
Conference paperIntegration of polymer self-assembly for lithographic applicationJoy Y. Cheng, Daniel P. Sanders, et al.SPIE Advanced Lithography 2008
PaperThermally Developable, Positive Resist Systems with High SensitivityHiroshi Ito, Reinhold SchwalmJES
