NEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.

Abstract

Accurate wafer temperature measurement is very important in the area of material processing. In short time annealing, for example, it is necessary to monitor temperature peaks of up to 1200 degree C which are only a few seconds in duration. This paper describes a structure consisting of a silicon wafer with a specially attached thermocouple. This structure is capable of reliable high temperature measurements of up to 1200 degree C and is also capable of surviving repeated cycling at that temperature.