Thick film positive photoresist: development and resolution enhancement technique

Abstract

The development of a thick film resist for magnetic head fabrication is described. The resist family is called the SJR 3000 series that has been jointly developed by IBM and the Shipley Co. and includes three different thickness grades. The lithographic performance of these resists is described as well as the process latitude. Moreover, an optional process is presented that improves the resolution capability of thick film resist photolithography.