Thermal and mechanical properties of polyimide films

Abstract

Polyimide films are commonly used as insulators for microelectronic devices because of their low dielectric constant, thermal stability and low processing cost. Biphenyldianhydride-phenylenediamine (BPDA-PDA) and pyromellitic dianhydride-oxydianiline (PMDA-ODA) are two of the commonly used polyimide films in the electronics industry. An investigation of their thermal expansion coefficients and mechanical properties is presented. These properties are important in determining the device structural integrity and for mechanical and thermal stress modeling studies.