Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperHigh speed silicon lateral trench detector on SOI substrateMin Yang, Jeremy Schaub, et al.Technical Digest-International Electron Devices Meeting
PaperAb initio molecular dynamics simulation of liquids and solutionsMichiel SprikJournal of Physics Condensed Matter
TalkAssessing wildfires hazards around the electric gridFernando Marianno, Wang Zhou, et al.INFORMS 2021
