About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
MRS Spring Meeting 1995
Conference paper
Surface-topography simulations of ionized sputter metal deposition
Abstract
Numerical simulations are used to predict microscopic topography of deposited metal films in ionized magnetron sputter deposition experiments. The simulation takes into account ionized and neutral fluxes as deposition material sources and re-sputtering and re-deposition of the deposited material due to the ion bombardment. The shock-tracking algorithm is used to advance the moving surface boundary. Applications of this deposition technique include lining and filling of trenches, vias and dual damascene.