PaperStructural and magnetic properties of Cr and Mn doped InNA. Ney, R. Rajaram, et al.Journal of Magnetism and Magnetic Materials
Conference paperInvestigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cablesAndreas C. Cangellaris, Karen M. Coperich, et al.EMC 2001
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
Conference paperFormation mechanism and suppression methods of copper dendrites in BEOL integrationShaoning Yao, Wei-Tsu Tseng, et al.ADMETA 2011
