Fiber array attach is a cost-effective, competitive and reliable packaging technology that enables input and output signal interfacing with silicon photonic devices. One key-step in this packaging sequence is the structural adhesive dispense ensuring mechanical integrity of the attach. This dispense appears as very challenging due the V-grooved substrate nature, the adhesive properties and the high-level process stability required by this application. In this paper, we compare the performances of three different dispensing methods already used on high-volume production packaging lines. We also demonstrate a high stability dispense on functional photonic integrated circuit dies. The developed methodology and associated trends described in this paper could be applied to all new adhesive dispensing developments for photonic applications.