Conference paper
Compression for data archiving and backup revisited
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
The miniaturization of integrated circuit devices necessitates modification of the present design and fabrication of their electrical contacts. In this review the miniaturization process is discussed and the requirements for contacts to sshallow junction devices are listed. The review is concluded with the presentation of three possible contact schemes, namely the metal-polycrystalline silicon contact, the shallow silicide contact and the silicide contact with dopant redistribution. © 1983.
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010