Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperVortex dynamics in YBaCuO single crystals with point- and line-like defects-flux creep studiesJ.R. Thompson, Yang Ren Sun, et al.Physica A: Statistical Mechanics and its Applications
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperShear and time-dependent rheology of a fully nematic thermotropic liquid crystalline copolymerDouglass S. Kalika, David W. Giles, et al.Journal of Rheology
