M.D. Thouless, H.M. Jensen, et al.
Proceedings of the Royal Society A
Paper
Relationship between interfacial adhesion and electromigration in Cu metallization
Abstract
The relationship between interfacial adhesion and electromigration in Cu metallization was discussed. The electromigration drift velocity and lifetime in a conventional electromigration was also derived. The results indicated a linear relationship between the electromigration activation energy and the intrinsic work of adhesion.
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