Conference paper
Theory for electromigration failure in Cu conductors
J.R. Lloyd, C.E. Murray, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2005
The relationship between interfacial adhesion and electromigration in Cu metallization was discussed. The electromigration drift velocity and lifetime in a conventional electromigration was also derived. The results indicated a linear relationship between the electromigration activation energy and the intrinsic work of adhesion.
J.R. Lloyd, C.E. Murray, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2005
C.-K. Hu, L. Gignac, et al.
MRS Fall Meeting 2007
K.G. Frase, E. Liniger, et al.
Advanced Ceramic Materials
J.L. Hedrick, S.A. Srinivasan, et al.
MRS Fall Meeting 1996