Recent advances in high temperature polymers for microelectronic applications

Abstract

High performance polymers play an important role as packaging materials in the current manufacturing and future development of microelectronic devices and components. We have focused on the design and development of several new polymer systems which meet many of the above requirements. Our polymer preparations are based on heterocyclic activated aryl ether synthesis to prepare new polyphenylquinoxalines and polybenzoxazoles, and condensation of bis(o-diamines) with bis(keto esters) to give polyquinoxalones. Both routes afforded high Tg thermoplastics. In addition, we have prepared polyimide random copolymers using novel heterocyclic-aryl ether based diamines. In this paper we describe the synthesis, thermal stability, and mechanical properties of these systems.