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Publication
Applied Physics Letters
Paper
Preferred orientation in bias-sputtered nickel chromium films
Abstract
It is shown that substrate bias during dc sputtering effectively reduces oxygen contamination in nichrome films. This in turn leads to an enhancement of the preferred orientation of the deposits. Moreover, it appears that substrate bias plays an additional role in film orientation which is related to the initial nucleation and growth conditions. © 1969 The American Institute of Physics.